Solder Ability Test

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The solder ability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solder ability requires wetting (low contact angle) of the substrate by the solder.

The solder ability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solder ability requires wetting (low contact angle) of the substrate by the solder. The procedure, considered to be destructive, tests whether the packaging materials and processes used during manufacturing operations produce a component that can be successfully […]

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