Higgs Boson Systems Pvt. Ltd.

Our journey started from a small seed and today we represent a big tree with its branches widespread across the globe. We are a group of vigorous and experienced technocrats who have more than 20 years of global exposure in the industries like Automotive, Petrochemical, Defense & Aerospace, Telecommunication, Industrial Applications, and Medical. We also have a group of energetic and vivacious staff who is sincerely committed and dedicated to satisfying our customers by offering them sophisticated, advanced machines, technical solutions, and services. We have a worldwide network of contented business associates across the industry. We have been consistent in providing timely delivery, intransigent quality service, and competitive price to our customers and this is what makes us invincible in the industry. Our motive is to grow persistently by continuously challenging our limits to achieve the greatest possible latitude. We aspire to keep ourselves streamlined with the prevalent technology and equipment launched in the industry and embrace the innovation to provide a cutting edge of service to our customers. Our goal is to climb the ladder of success consistently along with all our stakeholders (which include our manufacturers, customers, and employees) because we believe that an organization achieves great heights only if its stakeholders find it to be the best place to associate with. As an organization, we aim to raise and improvise our methods and services steadily in order to serve more and more customers and contribute substantially to the betterment of society.

Advanced Thin Film Processing for MMIC Manufacture

The widespread acceptance of wireless communication devices in recent years has led to a boom for manufacturers of III-V Monolithic Microwave Integrated Circuits (MMICs). As a result, these device fabricators have needed to adopt a significant amount of technology from leading silicon device makers in order to provide timely responses to the large demand for …

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Compressor

A compressor is a mechanical device that increases the pressure of a gas by reducing its volume. An air compressor is a specific type of gas compressor. Compressors are similar to pumps: both increase the pressure on a fluid and both can transport the fluid through a pipe. As gases are compressible, the compressor also reduces the volume of a gas. Liquids are relatively incompressible; while some can …

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Hardness Tester

Hardness is a measure of the resistance to localized plastic deformation induced by either mechanical indentation. In general, different materials differ in their Hardness,Macroscopic hardness is generally characterized by strong intermolecular bonds. Hardness is dependent on ductility, elastic stiffness, plasticity, strain, strength, toughness, viscoelasticity, and viscosity. There are 3 main types of Hardness measurements: Scratch …

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Tube Furnace

A tube furnace is an electric heating device used to conduct syntheses and purification of inorganic compounds and occasionally in organic synthesis. Its design consists of a cylindrical cavity surrounded by heating coils that are embedded in a thermally insulating matrix, Temperature can be controlled by feedback from thermocouples. Tube furnace two or more heating zones useful for transport experiments, It can …

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Why Gold – Tin is the best Solder Alloy

There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to over 1000°C. Yet, there is one alloy in particular that stands out and is most commonly used by the majority of users for die attach and lid seal applications. This alloy is gold-tin …

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Plasma Ashing

Plasma Ashing Process In semiconductor manufacturing plasma ashing is the process of removing the photoresist (light-sensitive coating) from a wafer. Using a plasma source, a monatomic (single atom) substance known as a reactive species is generated. Oxygen or fluorine is the most common reactive species. The reactive species combines with the photoresist to form ash …

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Vacuum / Pressure Reflow Oven System

Today, in the majority of high production soldering of electronic component applications, belt furnaces are used.  The typical length of a belt furnace exceeds 20 feet. Some of these high volume production processes require <200 ppm oxygen level, a nitrogen flush (to achieve such a low ppm oxygen level) and constant “power on” that keeps …

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Destructive Wire Bond Pull Testing

The reason that I chose to discuss wire bond pull testing after examining shear testing is that, in concurrence with the development process of a wire bond, we perform pull testing only after shear testing has been performed. The destructive pull test is explicitly what it sounds like. A wire bond loop is pulled until …

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Wire Bonding using Insulated Wire

 a)  Advantages – Prevents wire shorts and enables cross bonding. – Uses existing platforms and lowest-cost packaging infrastructure (wire bonding). – Is suitable for multi-row, ultra fine pitch and area array wire bonding. – Is suitable for systems in package, stacked dies and side-by-side chip-to chip bonding. – Enables flexible routing, simplified substrate and packaging of …

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