SEMICONDUCTOR & THIN FILM COATING DIVISION

Vacuum Reflow Soldering Oven

1 Comment / Vacuum Reflow Soldering Oven / Higgs Boson Systems Pvt. Ltd.

Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a belt furnace exceeds 20 feet. Some of these high volume production processes require <200 ppm oxygen level, a nitrogen flush (to achieve such a low ppm oxygen level) and constant “power on” that keeps […]

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Plasma Technology

As we are getting advance in technology and we want our products to be more efficient and more reliable, we need to keep advancing in technology further more. When it comes to semiconductor devices and components we have to be at best for the better result, and so we need to avoid using chemicals for

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