Wafer Cleaning Process

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Wafer cleaning simply means- to get rid of particles and contaminations. The objective of the wafer cleaning process is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate. The surface of the wafer must be maintained not affected so that roughness, corrosion or pitting negates the results of the wafer cleaning process. The yield of a silicon wafer is inversely related to the defect density (cleanliness and particle count) from the processing done on the wafer. One way to reduce defect density and increase yields is to use efficient wafer cleaning processes that remove particle contaminants efficiently. With smaller semiconductor devices and geometries the removal of smaller particles from silicon wafers has become more critical. Small particles can be difficult to remove since strong electrostatic forces exist between the particles and the wafer substrate.

Wafer cleaning simply means- to get rid of particles and contamination. The objective of the wafer cleaning process is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate. The surface of the wafer must be maintained not affected so that roughness, corrosion or pitting negates the results of […]

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