Advantages Quasi room-temperature process The wedge wire bonding processes do not require external thermal energy. In contrast to other methods like resistance welding, soldering or laser welding, the substrate to be bonded does not need to be heated nor does the wedge bond process induce heating. During the wedge bonding process, very localized heating occurs […]

Let us take a look at some of the recent applications, such as opto-electronics and stacked die packaging where wire bonding has been used. By understanding the demands made by these new packaging applications, one can appreciate the criticality of understanding the wire bonding technology and its importance in the “food chain” of microchip manufacturing

As new high-speed products with ever-increasing capabilities are developed and introduced into the market, new advanced IC packaging designs and methods also must be developed to meet these new products’ requirements. New advanced packages are being designed to maximize I/O numbers, minimize wire bond loop length, and provide System-In-Package (SiP) performance. Stacked die packages, providing (SiP) performance, are already the mainstream of cellular phone manufacturing. Wire bonded Lead-On-Chip (LOC, FBGA)

Materials with low surface energies like polymers and metals are not wettable by printing ink and adhesives. These materials require some treatment to match the surface tension of adhesives. The procedure of using chemicals, plasma or radiations for increasing the surface tension of non-polar materials is called as surface activation. Although every method of activation has its own pros

With the boom of customization and automation in the automotive industry, the need for finely tuned methods for producing high-quality automobiles is also increasing. The automotive industry relies on a number of robust preconditioning processes for producing rugged and reliable automobiles. One such process is plasma treatment. Although automobile manufacturers have been using plasma treatment in the automotive industry for the surface treatment of automotive parts for years, plasma treatment can also be used for

Surface wettability plays an important role in determining the function of a wound dressing. Dressings with hydrophobic surfaces are suitable for bacterial adsorption, however, a hydrophilic surface is needed to improve cell attachment for most anchorage-dependent cell types. Furthermore, the  hydrophobicity/hydrophilicity of the surface can be used to direct cellular processes such as cell initial

MPCVD is a very important method that has been frequently used for diamond deposition. Here, microwave plasma is used to activate the hydrocarbon feed and dissociate molecular hydrogen. Typically, 2.45 GHz is used as an excitation source. Microwave plasma oscillates electrons, which in turn produces ions by colliding with gas atoms and molecules. A schematic representation of a microwave plasma reactor is shown below for understanding. However, the deposition area is restricted

ADVANTAGES OF RIBBON AND THE IMPACT ON THE MICROWAVE MARKET Interconnecting semiconductors with ribbon rather than round wire has been popular in high-frequency electronics fora long time. Surprisingly there are still countless applications bonded traditionally with round wires and ball bonders even so the electrical performance of the product could benefit from ribbon bonding technology. Reasons for this hesitation to adopt ribbon technology can be found in the