UV Ozone Cleaner

The damage-free dry cleaning method can remove the organic contaminants that stick to the substrates by a photochemical oxidation resolution process.  

Benefits of UV ozone cleaning method: ●Easy removal of organic contaminants on the substrate that could not be removed by ultrasonic cleaning alone. ●Removal of the organic solvent used in wet cleaning. ●Possibility of removing organic contaminants without damaging the substrate surface. ●Easier accumulation of the L-B film. (cumulative rate is greatly improved.) ●Available at atmospheric pressure. Not required vacuum device.

The principal of UV ozone cleaning: 

UV ozone cleaning is a photosensitive oxidation process using short wavelength UV light. During this process, organic contaminants such as photoresist, resin, silicon oil, and flux are decomposed by absorbing UV radiation with short wavelengths. Oxygen molecules become ozone at the wavelength of 184.9 nm and ozone is decomposed at a wavelength of 253.7 nm, simultaneously producing reactive oxygen species. Most of the 253.7 nm UV light is absorbed by hydrocarbons and ozone. The products of the decomposed contaminants react with the reactive oxygen species and form simpler volatile molecules (ex. CO2 H2O etc.), then detach from the substrate surface. When both 184.9 nm and 253.7nm wavelengths UV light exist, oxygen atoms continue to be generated and turn into ozone, then the ozone decomposes. Converting the 184.9 nm UV light into energy per mole is 647 KJ/mol. Converting the 253.7 nm UV light into energy per mole is 472 KJ/mol. The binding energy of various molecules of organic matter is listed in the below table.

Binding	Binding energy （KJ/mol）	Binding	Binding energy （KJ/mol）
Ｏ－Ｏ	138.9	Ｃ＝Ｃ	607
Ｏ＝Ｏ	490.4	Ｃ≡Ｃ	828
Ｏ－Ｈ	462.8	Ｃ＝Ｏ	724
Ｃ－Ｃ	347.7	Ｃ－Ｃｌ	328.4
Ｃ－Ｈ	413.4	Ｈ－Ｆ	593.2
Ｃ－Ｎ	291.6	Ｃ－Ｆ	441.0
Ｃ≡Ｎ	791	Ｈ－Ｃｌ	431.8
Ｃ－Ｏ	351.5	Ｎ－Ｈ	309.8

Application of UV Ozone Cleaner

  Application related to electron microscope :

1. Decontamination of SEM-TEM sample 
2. Improve wettability and affinity of diamond knives and glass knives 
3. Improvement of wettability and hydrophilicity of supporting film  

  Thin film preparation pretreatment :

1. ITO membrane cleaning of organic EL 
2. Base cleaning process before LB film accumulation 
3. Photoresist cleaning/removal
4. Silicon wafer, lens, mirror, solar panel, cold rolled steel, inertial guiding subcomponent. CaAs wafer cleaning 
5. Cleaning hybrid circuit, flat panel, LCD
6. Improved adhesion of coating to plastic 
7. Substrate cleaning process before film formation by dipping method  

  Others applications:

1. AMF cantilever cleaning
2. Surface modification of PDMS 
3. Cleaning of Hermetic seal for ultrahigh vacuum 
4. Flux removal 
5. Gas venting of glass material 
6. Etching of Teflon, Viton, other organic materials 
7. Gas venting of glass material 
8. Removal of wafer tape 
9. Ink removal from tested wafers 
10. Ta2O5 Dielectric film annealing  
11. Removal of dicing tapes

Application of Vacuum Electron Staining Apparatus

1.  Enhancement image contrast for polymer specimens (TEM)
2. Fixation for polymer specimens before ultra microtome sectioning (SEM/TEM)
3.  Reduction of outgassing from specimens at in electron microscope chamber (SEM/TEM)
4.  Elimination or reduction of charging effects on non-conductive specimens (SEM)
5. Embrittlement of specimens before fracturing (SEM)