It has been indicated that under conditions of glow discharge, ion bombardment of the cathode will occur. This results in the erosion of the cathode material and is termed plasma sputtering, with the subsequent omni-directional deposition of the sputtered atoms forming coatings of the original cathode material on the surface of the sample and work […]
Sputter Coating principle for use in Scanning Electron Microscopy Read More »
If we classify the materials on basis of their electrical property we can broadly classify them into three main categories namely Conductors, Insulators and Semiconductors. In this blog we will be discussing about semiconductors, doping and the method of doping. Though the exact invention year of semiconductor characteristic of material is not known but one
Doping and Dopants Read More »
Physical vapour Deposition (PVD) is a family of processes that is used to deposit layers of atoms or molecules from the vapour phase onto a solid substrate in a vacuum chamber. PVD is characterized by a process in which the material goes from a condensed phase to a vapour phase and then back to a
Sputtering v/s E Beam Vapour Deposition Read More »
The damage-free dry cleaning method can remove the organic contaminants that stick to the substrates by a photochemical oxidation resolution process. Benefits of UV ozone cleaning method:●Easy removal of organic contaminants on the substrate that could not be removed by ultrasonic cleaning alone.●Removal of the organic solvent used in wet cleaning.●Possibility of removing organic contaminants
Electron microscopy has a diverse range of applications in practice. The ability to view the microscopic structure of a specimen at a higher resolution than what is possible with optical microscopy gives it a distinct role in scientific research and industry applications. Several of these applications are covered in more detail below. Scientific Research :
Application of Electron Microscopy Read More »
A mask aligner is a precision machine tool used in the semiconductor manufacturing process to transfer a pattern onto a wafer or substrate; these patterns are micro and Nano in scale. The patterns (structure) are created using a light transfer method, where the pattern (printed on photo mask) to be printed is placed between a
Mask Aligner System Read More »
In my last blog “Doping and Dopants” we have seen that what is doping and what are the different types of dopants and how to select which dopant to be used. More or less we all are familiar that doping is a process of adding of desired impurities in the semiconductor material to deliberately change
Researching surface modification to develop high-performing materials is one of the main objectives in surface characterization today. Characterization, when used in materials science, refers to the broad and general process by which a material’s structure and properties are probed and measured. With the time there has been advancement in the characterization techniques and it is
Scanning Electron Microscopy (SEM) Read More »
Scanning electron microscopes (SEMs) are versatile tools that can provide nanoscale-level information about a wide range of samples with little or no sample preparation. In some cases, however, sputter coating the samples before working with SEMs is necessary to obtain a good-quality SEM image. SEMs can image all kinds of samples: ceramics, metals and alloys, semiconductors, polymers, biological
Sputter Coating for SEM: How This Sample Preparation Technique Assists Your Imaging? Read More »
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaic, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many micro
