SPUTTERING is a widely used and highly versatile vacuum coating system used for the deposition of a variety of coating materials. Plasma at higher pressure is used to “knock “metal atoms out of a “target”. These energetic atoms deposit on a wafer located near the target. The higher pressure produces better step coverage due to […]
Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a belt furnace exceeds 20 feet. Some of these high volume production processes require <200 ppm oxygen level, a nitrogen flush (to achieve such a low ppm oxygen level) and constant “power on” that keeps
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As we are getting advance in technology and we want our products to be more efficient and more reliable, we need to keep advancing in technology further more. When it comes to semiconductor devices and components we have to be at best for the better result, and so we need to avoid using chemicals for
About Climatic Chamber “For heating, the chamber load is exposed to defined temperatures at atmospheric pressure within a climate chamber. Thermal energy is transferred by convection and radiation to the chamber load.In the case of cooling, on the other hand, the heat is extracted from the chamber load and released to the environment outside the
