In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaic, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many micro […]
Thermal shock occurs when an object is rapidly cooled from high temperature. The surface layers contract against the inner layers, leading to the development of tensile stress and the propagation of cracks. Causes of Thermal Shock- Thermal shock occur when too much stress is created in a piece of ware during the heating and cooling process. It
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E Beam Lithography Electron-beam lithography (often abbreviated as e-beam lithography, EBL) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist. Electron Beam Lithography (EBL) allows users to write patterns with extremely high resolution, smaller than 10nm in size. Important
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India does not have adequate legislations that can prevent illegal dumping of spent lithium batteries. Electric vehicles (EV) are a part of the new normal as the global transportation sector undergoes a paradigm shift, with a clear preference towards cleaner and greener vehicles. Like its western counterparts and China, India has pushed the mandate for
Electric Vehicle Battery Recycling in India: An Opportunity for Change Read More »
During live Test energy dissipation Material Type Size of Chamber for future requirement Gases release during tests Location of installation Energy Dissipation During selection of Environmental chamber for test we should aware the testing procedure. If there is such test where DUT will release energy, the internal temperature can be effected as per set (require)
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High reproducibility and safely operations Principles: What is electron staining? Electron staining is a method for enhancement image contrast of electron microscopy specimens which are composed with light element (eg. polymer materials, biological specimens etc.), by binding heavy metals. For polymer specimens, osmium tetroxide (OsO4) and ruthenium tetroxide (RuO4) are often used. What is “vacuum” electron staining?
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Objective: Osmium Plasma Coater (OPC) is the plasma coating device that uses the DC glow discharge method to coat conductive thin film mainly for SEM samples. No charging. No grains. No heat damages.An ultimate solution to obtain clear SEM images. The Osmium Plasma Coater is a kind of plasma CVD coater which is utilizing a method
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Wafer cleaning simply means- to get rid of particles and contamination. The objective of the wafer cleaning process is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate. The surface of the wafer must be maintained not affected so that roughness, corrosion or pitting negates the results of
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Intregrated Circuit ( IC ) Delayering Within the semiconductor industry, the business to tear down, deconstruct, or deprocess wafer level integrated circuits (IC) exists. This deconstruction process is pursued to conduct failure analysis and reverse engineering of the internal structure of the IC device. The IC’s are small chips which may have an areal size
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DLC for IR Optics ( Diamond like Carbon Deposition) : What is DLC ? DLC stands for Diamond-Like Carbon. From a material science point of view, this means that it shares many of the characteristics of diamond itself, or rather DLC emulates diamond’s properties enough to be considered similar. Some of these properties include the Hardness
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